Seoul, South Korea – [Date] – Javis Co., Ltd. (KOSDAQ: 254120), a leading X-ray inspection equipment specialist, today announced the official launch of its latest innovation, the Xscan-9800T25, a next-generation 2.5D AXI (Automated X-ray Inspection) system designed to meet the evolving needs of the global SMT/PCB industry.
The Xscan-9800T25 integrates Javis’s proven X-ray inspection expertise from the food, semiconductor, and secondary battery industries into a compact, high-performance platform. Leveraging advanced AI-driven image processing algorithms and laminography technology, the system delivers superior detection capabilities, identifying micro-defects that are difficult to capture with conventional 2D inspection, while also dramatically improving inspection speed.
“In AXI systems, detection accuracy, speed, and space efficiency are critical,” said a Javis spokesperson. “The Xscan-9800T25 offers higher precision than traditional 2D inspection methods, with a footprint 30% smaller than competing systems. Its exceptional inspection speed enables seamless in-line integration for real-time, 100% inspection, significantly boosting production efficiency.”
With this launch, Javis aims to expand beyond its strong presence in secondary battery and food inspection markets to establish a solid foothold in the SMT/PCB sector. The company also revealed plans to release a Real 3D AXI system later this year, further strengthening its global competitiveness and broadening its technology portfolio.